Dry Etch equipment engineer (semiconductor front-end FAB)
- Yuen Long, Hong Kong
- Permanent
- Full-time
- Proficient in semiconductor front-end module process technology research and development, with a strong background in dry etch equipment, such as ICP, CCP, IBE, etc, for typical CMOS-compatible wide bandgap (SiC or GaN) semiconductor technology.
- Cooperate with module process engineers and facility engineers to install and maintain dry etch process equipment, including various tasks from daily monitoring to major PM, for the specialty semiconductor process technology development.
- Responsible for setting up and updating the SOP for dry etch process equipment.
- Provide training sessions for team members and trainees on the best practices.
- Ensure process equipment both in development and in volume production, maintain comprehensive documentation of processes, troubleshooting, and updates for reference and compliance purposes.
- Bachelor’s degree in Electronics, Mechanics, Physics, Chemistry and Material Science, advanced degrees or certifications are a plus.
- At least 3 years’ working experience in semiconductor FABs, with direct experience in the dry etch process equipment in typical wide bandgap (SiC or GaN) semiconductor process integration in CMOS-compatible FAB.
- Strong analytical skills and the ability to resolve technical challenges efficiently.
- Good written and verbal communication skills in English and Chinese to coordinate with diverse internal module process and facility teams.
- Comfort working in a high-pressure, evolving environment with tight deadlines.
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