BGBM process engineer (semiconductor front-end FAB)

  • Yuen Long, Hong Kong
  • Permanent
  • Full-time
  • 19 days ago
ABOUT USHong Kong Microelectronics Research and Development Institute ("MRDI") is established to seize the huge potential market for third-generation semiconductors and align with the national strategy for technological development.The vision is for the MRDI to play a leading role in strengthening collaboration with the industry, academia, and research sectors, expediting the "1 to N" transformation of scientific research outcomes, promoting technological innovation, and assisting the industry in enhancing efficiency as well as achieving upgrading and transformation.Hong Kong Microelectronics Research and Development Institute (MRDI) is established to seize the huge potential market for third-generation semiconductors and align with the national strategy for technological development.The vision is for the MRDI to play a leading role in strengthening collaboration with the industry, academia, and research sectors, expediting the "1 to N" transformation of scientific research outcomes, promoting technological innovation, and assisting the industry in enhancing efficiency as well as achieving upgrading and transformation.The MRDI is looking for a dynamic and high-calibre professional to fill the position of semiconductor front-end module process engineer.Key Responsibilities
  • Proficient in semiconductor front-end module process technology research and development, with a strong background in backside process, such as grinding, backside patterning/etch/metallization, for typical CMOS-compatible wide bandgap (SiC or GaN) semiconductor technology.
  • Cooperate with PIE and device engineers to develop and provide backside solutions for the specialty semiconductor process technology development.
  • Responsible for setting up and updating SOP, OCAP，SPC for backside process, including data collection, verification and version control.
  • Responsible for resolving process issues and for improving inline/offline process control.
  • Provide training sessions for team members and trainees on the best practices.
  • Ensure module process for baseline and advanced processes both in development and in volume production, maintain comprehensive documentation of processes, troubleshooting, and updates for reference and compliance purposes.
Qualifications
  • Bachelor’s degree in Microelectronics, Physics, Chemistry and Material Science, advanced degrees or certifications are a plus.
  • At least 3 years’ working experience in semiconductor FABs, with direct experience in the backside process development in typical wide bandgap (SiC or GaN) semiconductor process integration in CMOS-compatible FAB.
  • Strong analytical skills and the ability to resolve technical challenges efficiently.
  • Good written and verbal communication skills in English and Chinese to coordinate with diverse internal PIE and device teams.
  • Comfort working in a high-pressure, evolving environment with tight deadlines.
Salary will be commensurate with qualifications and experience. A gratuity of 15% of the salary will be awarded upon satisfactory completion of the contract. The incumbent will normally work five days a week. The initial employment contract spans 12 months and can be renewed with a longer tenure upon mutual agreement of the incumbent and MRDI.APPLICATION PROCEDURETo apply, please submit the applications via CTgoodjobs by 25 August 2025. Please specify the present/ latest salary and expected salary in the CV. Only shortlisted candidates will be notified of the result of the application. MRDI reserves the right not to fill the position.MRDI is an Equal Opportunities Employer. Personal data provided by job applicants will be used exclusively for recruitment only.(Information provided by applicants will be used for recruitment and other employment-related purposes.)

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