GaN/SiC process integration engineer (semiconductor front-end FAB)

  • Hong Kong
  • Permanent
  • Full-time
  • 19 days ago
ABOUT USHong Kong Microelectronics Research and Development Institute ("MRDI") is established to seize the huge potential market for third-generation semiconductors and align with the national strategy for technological development.The vision is for the MRDI to play a leading role in strengthening collaboration with the industry, academia, and research sectors, expediting the "1 to N" transformation of scientific research outcomes, promoting technological innovation, and assisting the industry in enhancing efficiency as well as achieving upgrading and transformation.Hong Kong Microelectronics Research and Development Institute (MRDI) is established to seize the huge potential market for third-generation semiconductors and align with the national strategy for technological development.The vision is for the MRDI to play a leading role in strengthening collaboration with the industry, academia, and research sectors, expediting the "1 to N" transformation of scientific research outcomes, promoting technological innovation, and assisting the industry in enhancing efficiency as well as achieving upgrading and transformation.The MRDI is looking for a dynamic and high-calibre professional to fill the position of semiconductor front-end module process engineer.Key Responsibilities
  • Proficient in semiconductor front-end process technology research and development, with a strong background in process integration for typical CMOS-compatible wide bandgap (SiC or GaN) semiconductor technology.
  • Cooperate with R&D device engineers (DE) and FAB process engineers (PE) to develop and provide integration solutions for the specialty semiconductor process technology development.
  • Responsible for setting up and updating process platform for wide bandgap (SiC or GaN) process, including process flow generation and optimization, design rule generation and development testchip layout design, process integration DOE design and execution, MES/SPC/WIP/WAT data review and flow control, etc.
  • Responsible for resolving integration issues and work with PE for improving inline/offline process control and yield improvement.
  • Provide training sessions for team members and trainees on the best practices.
  • Ensure full flow process for baseline and advanced processes both in development and in volume production, maintain comprehensive documentation of process integration, troubleshooting, and updates for reference and compliance purposes.
Qualifications
  • Bachelor’s degree in Microelectronics, Physics, Chemistry and Material Science, advanced degrees or certifications are a plus.
  • At least 10 years’ working experience in semiconductor FABs, with direct experience in typical wide bandgap (SiC or GaN) semiconductor process integration in CMOS-compatible FAB. Development experience in front-end process module, such as etch or thin film, is a plus.
  • Strong analytical skills and the ability to resolve technical challenges efficiently.
  • Good written and verbal communication skills in English and Chinese to coordinate with diverse internal process teams and device teams.
  • Comfort working in a high-pressure, evolving environment with tight deadlines.
Salary will be commensurate with qualifications and experience. A gratuity of 15% of the salary will be awarded upon satisfactory completion of the contract. The incumbent will normally work five days a week. The initial employment contract spans 12 months and can be renewed with a longer tenure upon mutual agreement of the incumbent and MRDI.APPLICATION PROCEDURETo apply, please submit the applications via CTgoodjobs by 25 August 2025. Please specify the present/ latest salary and expected salary in the CV. Only shortlisted candidates will be notified of the result of the application. MRDI reserves the right not to fill the position.MRDI is an Equal Opportunities Employer. Personal data provided by job applicants will be used exclusively for recruitment only.(Information provided by applicants will be used for recruitment and other employment-related purposes.)

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